Honor is reportedly working on a wide foldable, and this could be the first folding handset featuring a 2nm flagship chip. A recent leak has shed light on how the company is planning to take over its rivals in the dual-fold smartphone market.
Weibo tipster @DigitalChatStation recently revealed new details about Honor’s first wide-fold creation. He suggested that the new device can take over the Huawei Pura X Max in terms of battery capacity and camera specs.
Read More: Honor wide foldable may take on Pura X Max in camera and battery
In addition, the tipster mentioned that the Honor wide foldable will be the first Android folding phone to use a 2nm flagship chip. This mobile SoC could be the Snapdragon 8 Elite Gen 6 Pro.
(Image Credits: Weibo)
Qualcomm will likely introduce 2026 premium-grade mobile processors in September. These chips can be the Snapdragon 8 Elite Gen 6 and Gen 6 Pro.
Both chips will adopt TSMC’s advanced 2nm process technology featuring higher transistor density and power efficiency over the previous versions. On the flip side, the Pro chipset can follow a 2+3+3 core architecture with a main frequency of 5GHz.
While the core configuration of the Snapdragon 8 Elite Gen 6 Pro is unclear at present, it will likely bring a significant performance boost with efficiency in mobile gaming and intense operations.
Honor hasn’t talked about its new wide folding phone yet. Although the leaks hint that the company can launch this creation in the third quarter of this year. Note that these details still lag accuracy and may change as per the company’s strategy.
