Huawei is reportedly teaming up with the Chinese government to build a new 12-inch chip wafer plant that can help it cut off some pressure from DRAM shortages. A new report suggests that the company is once again up to framing its own solution.
X tipster @SemiconductorX has revealed that Huawei has joined hands with Swaysure (Shenzhen Yiweixu) to develop a 12-inch chip wafer plant in Shenzhen, China.
The Chinese government is backing this fab. Details reveal that the new move will significantly focus on DRAM memory chipsets with a capacity of 140,000 wafers/month.
DRAM memory chips under this fab will begin with 28nm. The companies have also hired an experienced workforce that can rapidly reach a beneficial outcome.
Experience Talent includes an ex-TSMC fab director who will work as the CEO of the new 12-inch wafer plant. On the other hand, the former president of Elpida will be the head strategist in the fabrication.
Huawei hasn’t commented on this news yet. Although the new approach can help China to step into the self-reliant part for memory chips amid the US export controls. While SK Hynix, Samsung, and Micron still rule the global DRAM race with a 95% share, the new 12-inch wafer fab will stabilize China’s growth.
Moreover, the success in the new chip wafer plant will help in reshaping the supply chains, pricing, and geopolitics, and meet the growing AI memory demand in the market.
The translated screenshot reads:
“Shenzhen Ivysys Technology Co., Ltd. was registered and established in Shenzhen in March 2022, with its headquarters in Longhua, Shenzhen. It is currently constructing a 12-inch wafer fab line with a 28nm process capability, primarily focusing on DRAM memory, with a planned capacity of 140,000 wafers per month.”
(Image Credits: X)
