Huawei has already started gathering components for the Mate 90 series, and a new piece of information suggests that the flagship lineup could get a big jump in heat management with an incredible chipset-level active cooling fan tech upgrade.
The Chinese phone maker prioritizes cooling solutions mainly in its high-end models due to their performance status, and the Mate line perfectly fits with this statement.
Mate 80 series, for example, brings high-end specifications, tagged with a top-quality camera system. While these aspects fulfill the user demand, they also generate immense heat inside the smartphone, which is often offset by a vapor chamber.
But tipster DigitalChatStation reported that apart from a powerful Kirin 5G processor, Huawei will use a special chip-level MEMS cooling tech upgrade for Mate 90.
As per the leaker, Huawei is testing a MEMS (Micro-Electro-Mechanical System) active cooling fan. This solution will closely adhere to the chip-grade cooling solution.
The MEMS-based cooling solution refers to an active fan-on-a-chip tech. It has microscopic silicon chips that operate at ultrasonic frequencies to create a direct airflow.
What’s more interesting about this kind of cooling tech is that the fans are quite lightweight and silent compared to the outdated fan solutions that make the phone bulky. Instead, the new cooling tech works without spinning blades or the inside motor.
Moreover, it has a cooling chip of 1mm beside the circuit board with many tiny silicon membranes that vibrate super-fast. Thus, the negative pressure pushes the air and eliminates the heat generated inside the device. So, the key benefits are:
- 1mm thin cooling chip
- Almost no noise
- Higher conduction efficiency
- Industry-leading technology
Huawei has already used a fan solution in the Mate 80 Pro Max WIND model. Hence, it won’t be a big deal for the company to implement an improved tech into its upcoming flagship phones.
(Image Credits: Weibo)
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