Huawei is reportedly working on a new phone memory solution called LLW (Low Latency Wide) DRAM and may introduce it by 2027. Amid the ongoing memory shortage and price increase challenges, the company is coming up with its own approach.
As noted by the tipster FixedFocus, Huawei and Xiaomi are both looking for a new “phone memory solution” named LLW, which might debut by the second half of 2027.
Details reveal that the LLW DRAM’s design concept is inspired by the HBM (High Bandwidth Memory) integration method. The new solution aims to improve AI computing efficiency within the packed space of a smartphone.
Xiaomi and Huawei are seeing LLW as an alternative to HBM for their top smartphones. Due to advanced packaging and heat dissipation tech needs, HBM can’t be used in handsets directly at the moment. But LLW can be a great choice.
LLW – Low Latency Wide DRAM is expected to balance both performance as well as practicability. It also has a more compact structure than HBM and can deal with bandwidth and latency issues efficiently over outdated LPDDR memory technology.
The LLW memory solution can reduce power consumption by 50% and is capable of achieving 1.5x improvements in performance. These are theory-based points. Hence, the core performance of this tech will become clear after its use in real life.
Since the new solution can take time in large-scale implementation, Huawei and Xiaomi products will likely bring it to the stage by the second half of next year.
Neither Huawei nor Xiaomi has commented on this matter so far. Therefore, there could be changes in this alleged strategy. Though based on the current scenarios in the market, there is a chance that firms will soon bring their own solutions.
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