Huawei is now sidelining 3D chip packaging technology in favor of chip-making improvements. A report reveals that while the OEM was waving rumors for using a new tech for its phone SoCs this year, it may halt the plan for a few years.
FixedFocus said that the 3D packaging tech for smartphone chipsets has once again swirling in the headlines for Huawei and TSMC, but they will focus on chip-making improvements for the next couple of years instead of going for the new approach.
3D chip packaging is an advanced semiconductor technology that stacks multiple dies (logic and memory) vertically into a single compact package via silicon vias or a hybrid bonding process.
This entire packaging not only enhances the chipset performance, but it also increases bandwidth, reduces latency, and lowers power consumption over 2D packaging.
However, a reason behind the sideline of 3D chip packaging technology is its drawbacks. While it frees up a lot of space inside phones for other key specs, it leads to manufacturing complexities and even higher costs.
(Image Credits: Weibo)
Keeping all the problems to one side, the major issue is heat generation. Since the new technology piles up individual chips on top of each other, it generates immense heat, which is incapable of escaping as the bottom layers block the path.
As a result, brands like Huawei and TSMC have reportedly decided to put a pause on the idea of using 3D chip packaging technology for the phone chips, at least for a few more years.
In the meantime, these companies will significantly focus on improving chip manufacturing. They may optimize fabrication processes to boost the chipset performance. Where exactly this will lead is currently uncertain.
For now, we can only look forward to upcoming smartphone chips by Huawei and TSMC, as well as their improvements.
(Image Credits: Huawei)
The post Huawei to improve chip-making instead of going for 3D packaging tech appeared first on Huawei Central.
