Huawei is already in the spotlight for its latest breakthrough in the chip tech field and in the current scenario, the company has collaborated with Chinese researchers and developed the world’s first 2D (two-dimensional) parallel computing chip.
While Moore’s Law drawbacks have started coming at the frontier, Chinese scientists are looking for enhanced alternatives that can solve chipset-making bottlenecks.
A 2D parallel computing chip built by Huawei and native researchers is one such approach. 2D components like molybdenum disulfide are thin and allow electrons to run stably throughout the process, making them strong to surpass Moore’s Law.
This 2D chip is called Mengqi-1000 or Magic 1000 (in English). It has gained record-breaking integration density. This new creation is proof that China is not only a leading country in terms of 2D semiconductor research, but it can also carve major developments without the need for American technologies.
Speaking of the new chip, Magic-1000 uses the RISC protocol designed for highly efficient command processing. Besides, it integrates a full set of core modules like an instruction decoder, register file, and ALU.
Magic-1000 consists of molybdenum disulfide transistors in a tiny area with a density of 9336 transistors per square millimeter – higher than previous records and comparable to mature silicon chips at the same node.
It further supports parallel multi-bit data input and output, operating at 43kHz. The new computing chip avoids off-chip memory delays – thanks to the register file applied directly on the chipset.
Technologies like the multilevel collaborative optimization method and hybrid approaches helped in the making of the 2D parallel chip. They managed the transistor uniformity from the material stage. Instead of a 2-row layout, it uses a 3-row layout, balancing noise margin and area.
Overall, these tech components pushed yield and performance high enough to develop a new 2D parallel microprocessor.
(Image Credits: Weibo)
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