Xiaomi is working on a third-generation chipset – XRING O3 and its design + frequency details. A new report has now revealed the key parameters and shed light on the upgrades the self-developed processor will offer over the previous version.
According to the information, Xiaomi XRING O3 is codenamed – lhasa. It will likely debut with the Xiaomi 17 Fold smartphone. This time, the company is trying to further simplify the XRING O3 chipset design.
Inputs mentioned that XRING O3 will feature on octa-design – a combination of Prime, Titanium, and Little cores. Here, the prime cores may exceed the 4GHz frequency mark this time.
On the other hand, the Titanium cores could run at 3.42GHz for several high-performance operations and intense gaming. Coming to the Little cores or the efficiency ones, they will run at 3.02GHz, a direct 1.79GHz of XRING O1.
Meanwhile, the GPU chip is at 1.5GHz, up from 1.2GHz on the previous-gen. Although its memory speed may remain unchanged at 9600MT/s. Overall, the Chinese tech giant is making efforts to enhance the 1+3+4 architecture of its new chip.
How many of these leaked specifications will turn out to be true is unclear at present. Though we may grab the official details in the coming days.
(Image Credits: Weibo)
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