Huawei has recently launched new 61.44TB and 122.88TB storage solutions (SSDs) using a special packaging tech. Since the company can’t access the 100+ layer 3D NAND due to the US restrictions, it adopted the Die-on-Board packaging process.
Before we proceed with the new storage solutions, let’s understand the new packaging tech.
Starting with 3D NAND – it is a manufacturing method that arranges memory cells vertically in multiple layers on a silicon wafer. This tech not only boosts storage capacity but also improves read/write speeds and lowers the cost per gigabyte.
Although this particular method uses the US-based technology, which is just out of the hands of Huawei due to the 2019 ban story. But looks like the OEM found its own way.
The company used DoB (Die-on-Board) packaging technology – a wafer-level or assembly method that stacks dies directly on the base printed circuit board (PCB).
Consequently, this leads to a larger capacity density over the outdated NAND die packaging through tighter integration of the NAND chips and lowers the overall cost.
((Image Credits: Huawei)
It can further provide a 33% capacity density improvement. The company has implied it in the OceanStor Pacific 9926 AFA Scale-out storage. A report on this topic said:
“Huawei’s AI SSD architecture integrates an AI acceleration unit into the SSD’s main control chip, enabling simultaneous storage and computing, reducing data transfer energy consumption by 80%. It breaks the limitations of the traditional 16-layer process.”
Even though Huawei has native suppliers like YMTC that offer Xtacking 4.0 3D NAND tech, it only delivers 232 layers, resulting in less SSD capacity than competitors.
Of course, the new Huawei packaging tech for SSDs has certain cons, like signal integrity and thermal management, which it may resolve with the upcoming OceanDisk 1800 storage solution. For now, the new solution hints that the OEM has started inching closer to the US rivals in the tech race.
Apart from the 61.44TB and 122.88TB, Huawei is also planning a 245TB SSD variant, which it will launch in the near future.
(Image Credits: Huawei)
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