Honor has dropped the first “official teaser” of Magic V6, giving a sneak peek at the device’s chipset details. The company hasn’t revealed the foldable’s true look yet. However, it has started hyping up the phone’s prime information and parameters.
It’s the first time that Honor has revealed the key details of the Magic V6 in its teaser. The company may introduce more highlights of the foldable in the coming days.
The video revolves around the winners of the Grand Slam and Golden Slam Winter Sports event. It also mentions Xu Mengtao who has recently won a gold medal in the women’s freestyle aerial skiing. (Know More).
But the highlight of this video appears in the end, where Honor revealed that the Magic V6 foldable will feature a full-fledged Snapdragon 8 Elite Gen 5 chipset.
Of course, it’s one of the best mobile processor choices for a flagship at present, and Honor has seemingly implemented the master-grade specs in its foldable.
Apart from the chipset, Honor didn’t mention any other spec details in the teaser. Highlighting the power and strength of the foldable phone, the company said:
“#HonorMagicV6# Together with China’s first Grand Slam and Golden Slam winners in snow sports @XuMengtao Pay tribute to every self who comes on with full blood and fights hard. #HonorMagic V6 makes its full-blood debut without leaving any effort#”
(Image Credits: Honor)
Snapdragon 8 Elite Gen 5 is a 3nm processor, featuring a custom 3rd-gen Oryon CPU cores up to 4.6GHz, a 20% faster Adreno GPU, and a 37% faster Hexagon NPU for smarter agentic AI. Its configuration is as follows:
- 2 x Prime Cores @ 4.61GHz
- 6 x Performance Cores @ 3.63GHz
What new technologies the company has added to complement the chip performance is currently unclear. Although the Magic V6 specs will soon be open to everyone. Stay tuned.
The post Honor Magic V6 first teaser reveals chipset details appeared first on Huawei Central.
